Year: 2026

Introduction

PAC Machine Edition (PME) provides users with an

integrated development environment to configure and

maintain control applications.  This environment provides

the tools to program and configure a wide range of

devices such as PACSystems QuickPanel+™ operator

interface, programmable automation controllers (PACs),

variable frequency drives, servos, and edge devices. Once

configuration is done, the same environment provides tools

to monitor, troubleshoot, and maintain control applications

throughout their lifecycle.

Integrated Environment

In addition to sharing common development tools, all PAC

Machine Edition components — View, Logic Developer,

and Motion Developer — share a common database and

common objects across applications. This means logic,

scripts, and HMI panels all share a common data model that

doesn’t require duplicating configuration in multiple spots.

Troubleshoot Across Multiple PLCs

PAC Machine Edition allows the user to open multiple

PME sessions on one PC and then connect each session to

a separate controller simultaneously. This allows the user

to view multiple application programs at the same time

from a single PC.

Pre-Loaded Edge Analytics and SCADA

Do more at the edge with the PACSystems RXi2-BP

optionally pre-loaded with Emerson’s PACEdge™ or Movicon.

NExT™ HMI/SCADA software. This industrial PC delivers

a powerful and tightly integrated solution with reliable,

industrial computing and innovative, scalable and flexible

automation software.

Based on OPC UA, Movicon.NExT is the first integrated

automation software platform for connectivity, IIoT, machine

HMI, HMI/SCADA and plant analytics.

Movicon.NExT enables connectivity to many native and

integrated communication protocols. It provides enhanced

visualization tools, including WPF, XAML and 3D graphics,

and also enables data recording independent of data

format used. With Movicon.NExT, users also get integrated

scripting, an alarm management system, and analytics

capable of acquiring production data in real time. These

analytics provide KPI and OEE performance data, calculate

machine downtime and can be used in tracking and

scheduling production.

PACEdge is a singular, secure, and controlled environment for

users to begin their Digital Transformation. Edge processing

maximizes the value of your data so you can generate real

insights and improve your operation’s reliability, safety, and

energy optimization. PACEdge provides the foundation

for these improvements by delivering all aspects of edge

processing with simplified IIoT application development,

deployment, and administration. All components necessary

in the IIoT application life cycle are brought together in this

single package to provide a unified and secure interface

to decrease your development time and increase your

deployable footprint.

High-Performance Computing

Emerson uses AMD Ryzen™ Embedded series processors

based on their unmatched performance. The PACSystems

RXi2-BP IPC has up to 16GB of ECC RAM, four Gigabit

Ethernet interfaces, and industrial grade high-speed SSD disc

storage to complete the high-performance design.

These features make the PACSystems RXi2-BP IPC the perfect

platform for running industrial applications right at the

machine, even in the harshest environments.

The PACSystems RXi2-BP design features 1 PCIe slot

expandability. This functionality combined with advanced

CPUs allows for flexible, high-performance computing. To

help keep data and operations secure, the PACSystems RXi2

BP utilizes Trusted Platform Module (TPM) and Microsoft

Secure Boot technology.  PACEdge provides the foundation

for these improvements by delivering all aspects of edge

processing with simplified IIoT application development,

deployment, and administration. All components necessary

in the IIoT application life cycle are brought together in this

single package to provide a unified and secure interface

to decrease your development time and increase your

deployable footprint.

Greater Uptime

All aspects of the PACSystems RXi2-BP IPC have been

engineered for reliability in harsh environments. With high

quality industrial components, a rugged design, and fanless

operation, it is perfect for both commercial and industrial

applications. The PACSystems RXi2-BP IPC is a highly reliable

IPC with a long life cycle.

The foundation of the PACSystems RXi2-BP IPC architecture

is Emerson’s rugged COM Express modular CPU platform.

Emerson also incorporates patented thermal monitoring

technology with sophisticated passive cooling techniques

to provide the highest-performance, fanless industrial

computing platform that can operate in extended

temperature ranges.

Enhanced Productivity &

Lower Total Cost of Ownership (TCO)

The foundation of the PACSystems RXi2-BP IPC combines

high performance with reliability, enhancing productivity

and reducing cost of ownership. The PACSystems RXi2-BP

IPC delivers low TCO through features such as compact size,

reduced maintenance, low power consumption, and ease

of future performance upgrades enabled by our innovative

rugged COM Express CPU architecture.

The Next Generation of Powerful, Reliable, Ruggedized Computing

Introduction

Emerson has developed the next generation of its powerful,

expandable, and reliable industrial computers (IPC).

PACSystems RXi2 IPCs offer new processor choices, increased

and faster storage, improved graphics, and enhanced

security features.

The PACSystems RXi2-BP IPC delivers compact, rugged,

mid to high range performance to run HMI, historian,

and analytics applications right at the machine, enabling

improved real-time control of operations and better

integration into plant-wide systems.

Combining outstanding compute capabilities with a compact

and robust enclosure, the PACSystems RXi2-BP is ideal for a

range of demanding industrial applications.

The foundation of the PACSystems RXi2-BP IPC combines

high performance with reliability, enhancing productivity

and reducing cost of ownership. The PACSystems RXi2-BP

IPC delivers low TCO through features such as compact size,

reduced maintenance, low power consumption, and ease

of future performance upgrades enabled by our innovative

rugged COM Express CPU architecture.