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IBA ibaFOB-2io-X I/O Concept

The ibaFOB I/O Concept

The unique peripheral I/O concept based on the ibaFOB boards, features characteristics

otherwise unknown on standardized field busses such as:

 Full deterministic transmission profiles for all fiber optic buses and connected devices

(1 ms).

 Internal and/or external synchronization on the bus, even for more than one bus with

programmable cycle times between 1.0 and 9.9 ms in steps of 100 μs.

 Deviation less than 2 μs between several busses (external synchronization)

 The iba fiber optic transmission standard integrates not only A/D converters (ibaPADU)

but a huge variety of PLC interfaces and hence allows the realization of heterogene

ous measuring and I/O topologies. The following devices can be connected:

 ibaFOB cards incl. ibaFOB x/4-F (ISA) and ibaFOB-OF-Link

 ibaLink-SM-64-io (Siemens Simatic S5 115U, 135U 155U; MMC216 all types)

 ibaLink-SM-128V-i-2o (VME32 & VME64 rack)

 ibaNet750 (Wago IO system 750)

 ibaBM-FOX-i-3o (FO-splitter and repeater)

 ibaPADU-8. ibaPADU-8-ICP, ibaPADU-8-M, ibaPDAU-8-S, ibaPADU-16.

ibaPADU-16-M-2. ibaPADU-32-T, ibaPADU-32-R and ibaPADU-8-O

 ibaBM-SLM (Simolink Monitor for Siemens Motion Link Bus)

 ibaBM-DDCSM (Monitor for ABB DDCS+ Drivebus)

 Adjustable bus timing (ring topology in combination with ibaLogic only!)

 Easy handling without the termination problems of copper based systems

 The integration in hazardous areas is no problem in terms of EMI due to the fiber

optic communication concept.

 One source can be accessed by multiple clients at the same time by just multiply

ing the optical fibers (ibaBM-FOX-i-3o and ibaFOB-OF-Link splitting devices) – so

I/O peripherals may be used for process control and measuring at the same time.

This also makes redundant structures easy.

IBA ibaFOB-2io-X is a fiber optic communication card

Introduction

The board ibaFOB-2io-X is a fiber optic communication card like the other well-known

boards ibaFOB-io-PCI, ibaFOB-io-S, ibaFOB-4i-PCI, ibaFOB-4i-S, ibaFOB-4o and iba

FOB-OF-Link which are used to connect a standard PC to the iba peripheral devices

such as ibaPADUs, ibaNet750 devices and ibaLink signal modules (SM).

The essential difference to the boards without the “X” in the name is a higher data trans

mission rate on the fiber optic link. Of course, in order to take advantage of this enhanced

data rate there should be the appropriate peripheral devices installed which support the

high data rate too. On one hand these are devices from iba which care the “X” in the

name and on the other hand system components of other manufacturers like ABB AC

800 PEC or Simatic TDC with LO5A interface.

As far as the following text does not refer to a particular card, the boards are referred to

as ibaFOB boards.

What’s new?

The ibaFOB-2io-X and respectively the ibaFOB-4i-X and ibaFOB-2i-X card represent the

new generation of iba’s fiber optic PC boards. These boards extend the existing board

family and will replace the previous ibaFOB-cards in long-term. The new boards are

100% compatible on the fiber optical bus side while in the PC the interface and dual port

ram layout differ between the old and new boards.

IBA ibaFOB-TDCexp Interface Card for SIMATIC TDC

The ibaFOB-TDCexp card couples the iba Process Data Acquisition system ibaPDA with

the Siemens control system SIMATIC TDC. To achieve this, the ibaFOB-TDCexp card

must be connected to one of the free ports of the CP52IO (GDM Interface Module of the

SIMATIC TDC).

The CP52IO realizes the access to the GDM memory card CP52M0. Using a fiber optic

link the TDC racks are connected to the CP52IO via the CP52A0 card. Up to 44 TDC

racks can be connected to the GDM in total. For the TDC system, the ibaPDA PC with

an ibaFOB-TDCexp card acts like a TDC rack, the ibaFOB-TDCexp card acts like a

CP52A0 card.

This topology enables the ibaPDA system with an ibaFOB-TDCexp card to communicate

notionally with every processor in one of the connected TDC racks (max. 43).

IBA ibaFOB-TDCexp Operational modes

Operational modes

To measure SIMATIC TDC system numeric and binary values must be transported be

tween the TDC system and the PC, which means that internal variables of the TDC sys

tem may be visualized and recorded. For recording purposes two different software pack

ages are supported by the ibaFOB-TDCexp card:

 SD-TDC-lite:

All values to be measured by ibaPDA have to be manually programmed in CFC

charts of the control unit. Changes of signals require a change in this chart. Up to

16 process telegrams are to be defined per card which transport the values to

ibaPDA containing 32 analog plus 32 digital variables each. Structure and length of

the process telegrams are determined by ibaPDA. Up to 4 cards in a PC are sup

ported by ibaPDA.

In addition the ibaPDA-Technostring (non-structured ASCII-string with a length of up

to 512 bytes) can be configured.

 SD-TDC-Request:

The definition of the signals to be measured is independent of the connected con

trol unit system. All changes are done in ibaPDA. ibaPDA supports the functionality

to select the internal TDC variables by their names, i.e. the chart, function block and

the connector names. To do that for every TDC CPU special service function blocks

must be included in the CFC chart of the control unit.

The information about the variable names (address books) is transferred from the

TDC CPU to the ibaPDA system directly via the ibaFOB-TDCexp card.

ibaPDA supports up to 4 cards with up to 50 processor connections per card and

additionally, the ibaPDA-Technostring.

Eaton PAC8000 8701-CA-BI Redundant BIM Carrier

8701-CA-BI Redundant BIM Carrier

For details on the installation and operation of the BIM Carrier, refer to the PAC8000 I/O

– PROFIBUS DP BIM Instruction Manual, INM8507.

Features

 accommodates two Bus Interface Modules

 supports PROFIBUS-DP

 provides dual PROFIBUS network connections

 can be used with DIN rail or panel mounting

Standard and Extended Diagnostics

The PROFIBUS BIM supports Standard and Extended Diagnostics. While the Standard

Diagnostics provide standard PROFIBUS status information, the Extended Diagnostics

provide detailed information relating to the status of the BIM, the health of the modules

and the status of I/O channels. Depending on the I/O module type, events such as high

and low alarm, open circuit and line fault are detected.

Extended Diagnostic messages are generated on detection of any anomalies in I/O

modules. Use of the diagnostic capability requires suitable support in the host application.

For hosts unable to use diagnostic data in the control algorithm, it is possible to map the

diagnostic data into the input dataframe.

Eaton 8507-BI-DP supports parameterization from the PROFIBUS master

Parameterization

The 8507-BI-DP supports parameterization from the PROFIBUS master.

The configuration is created in a PROFIBUS configurator using details provided in

a GSD file. This method is fast and enables a configuration to be built based upon

“logical” modules which represent the physical modules. Modules are added one

at a time to the configuration.

The configuration is passed from the PROFIBUS master to the BIM at the start of

communication. If the system is stopped and re-started, or if the node goes through

a cold start cycle, the configuration file is retransmitted to the BIM.

Standard and Extended Diagnostics

The PROFIBUS BIM supports Standard and Extended Diagnostics. While the Standard

Diagnostics provide standard PROFIBUS status information, the Extended Diagnostics

provide detailed information relating to the status of the BIM, the health of the modules

and the status of I/O channels. Depending on the I/O module type, events such as high

and low alarm, open circuit and line fault are detected.

Extended Diagnostic messages are generated on detection of any anomalies in I/O

modules. Use of the diagnostic capability requires suitable support in the host application.

For hosts unable to use diagnostic data in the control algorithm, it is possible to map the

diagnostic data into the input dataframe.

Eaton 8507-BI-DP Bus Interface Module

The 8507-BI-DP Bus Interface Module (BIM) provides the communications

link between the PAC8000 series I/O modules and a PROFIBUS-DP host.

High-speed acquisition of data from the modules and LAN operation speeds

of up to 12 Mbaud allow the host to respond rapidly to changes in process

conditions.

8507-BI-DP Bus Interface Module

For details on the installation and operation of the BIM, refer to the PAC8000 I/O

– PROFIBUS DP BIM Instruction Manual, INM8507.

Features

 support for up to 24 I/O modules

 redundant operation

 extended diagnostics for module and channel status

 PROFIBUS network speeds of up to 12 Mbaud

 non-volatile memory for configuration

 configurable via PROFIBUS host

 HART Pass-through support to monitor/configure HART devices

 Configuration/Reset of IP address

Eaton PAC8000 8507-BI-DP BIM Carrier

8507-BI-DP BIM and 8701-CA-BI Carrier

PROFIBUS DP Bus Interface Module and Carrier

The 8507-BI-DP Bus Interface Module (BIM) provides the communications

link between the PAC8000 series I/O modules and a PROFIBUS-DP host.

High-speed acquisition of data from the modules and LAN operation speeds

of up to 12 Mbaud allow the host to respond rapidly to changes in process

conditions.

The BIM gathers data from the I/O modules and makes it available to the

host upon request. It is a slave tothe PROFIBUS master. As well as cyclic

data exchange, which is required for reading input and writing output data,

the BIM supports PROFIBUS Extended Diagnostics for status information.

The BIM(s) must be used with an 8701-CA-BI Redundant BIM Carrier, described

on page 4.

Redundant BIMs can be used for critical applications. Each BIM in the redundant

pair operates in parallel, continually checking status to enable the backup BIM to

monitor the health of the primary BIM.

ABB Vishay ESTA Phao 4/3 50uF 4kV 301kVAr 3-Phase Power Capacitor 3BHL000359P0001

Vishay ESTA is the world’s only manufacturer to offer a complete range of power capacitors.

These cost-effective devices for harmonic control, energy savings, and voltage stabilization

are highly reliable and environmentally safe, and can be used under the most rugged

conditions. Vishay ESTA power capacitors address a wide range of energy-generation

applications. Their “green” applications include energy generation in on- and off-shore wind

turbines and solar power plants.

Vishay ESTA power capacitors are used in energy transmission and distribution in high,

medium, and low-voltage networks to improve network quality. Their efficient operation

helps promote CO2

reduction as well as reducing losses in long-distance HVDC

transmissions. The power capacitors are also used for RFI filters and voltage and

frequency converters in traction and industrial drives.

Vishay ESTA capacitors are manufactured with the highest quality standards and come

complete and ready to use for all applications.

ABB Vishay EsTa Furnace capacitors

Furnace capacitors

Applications

• Static power capacitors for inductive heating plant

compensation

standards

• En 60110/1 and 2

• IEC 60110/1

Ranges

• mains frequency: 230 V to 3000 V, 50/60 Hz up to

800 kvar per unit

• medium frequency: 250 V to 4000 V, 150 Hz to

100 000 Hz, up to 10 000 kvar per unit

Benefits

• Compact construction

• Each product designed to customer specifications

• Can operate in extreme environmental conditions

• Easy to integrate into overall system concepts

• Low inductivity

Types of cooling

• natural cooling

• Forced cooling

• water cooling

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