Category: SCANLAB

Massive process acceleration through parallel machining

The unique combination of a precise galvano metric scanning

system and beam splitting in one system allows to multiply laser

cutting, drilling or ablation processes without loosing the freedom

of geometry of the scanner. Using diffractive opticalelements (DOEs)

the incoming laser beam is split up into multiple beams, generating

multiple laser spots in the work plane of the scanning system.

This way multpile structures can be processed in parallel or,

for example, complex cut patterns can be realized while multiplying

the production output. The MultiBeamScanner is the solution to

significatly reduce production costs in laser micromachining of periodic

structures by up to two orders of magnitude.

Wavelengths

• IR  (1030nm-1070nm)

• VIS  (515nm-532nm)

• UV  (343nm-355nm)

Scan lens for ultra-high resolution applications ‚the 1μm laser knife‘

Extend your laser machine with a High-NA scanning solution

With the Microscan Extension MSE, Pulsar Photonics offers a simple but powerful extension for

any galvo scanning system. By simply exchanging a conventional scan lens with the MSE-G2. the

user can convert his machine to a micro spot scanning system. The combination of galvanometer

scanner and MSE-G2 allows high-precision processing with a focus diameter of less than 4μm.

This enables the production of the smallest components with unmatched accuracy and level of

detail. We offer the system for IR, VIS and UV wavelengths.

Technical data

• IR/VIS Version: MSE-G2 IR/VIS

• UV Version: MSE-G2 UV

• Max. Dimensions: (L x W x H): 245mm x 145mm x 120mm

• Working distance: > 20 mm (IR/VIS), > 10 mm (UV)

• Scan field size: typ. 500µm x 500µm

• Integrated coaxial camera

• Fastening thread: M85x1 (standard galvo scanner)

• Integrated collision protection

Wavelengths

• IR (1030nm-1070nm) + VIS (515nm-532nm)

• UV (343nm-355nm)

Spot sizes (for laser beam source with M²< 1.3)

• < 4µm    (IR/VIS version)

• < 2µm    (IR/VIS version)

• ≤ 1.5µm (UV version)

• LIDT coating @ 355nm; 10ps: < 0.5mJ/cm²

• LIDT coating @ 532nm; 10ps: < 3mJ/cm²

• LIDT coating @ 1064nm; 10ps: < 6mJ/cm²

excelliDRILL

excelliDRILL is SCANLAB’s latest product development for drilling printed

circuit boards. The new motor design, SCANahead based control algorithms,

together with proven SE encoder technology, and lightweight beryllium mirrors

enable outstanding drilling rates with maximum precision. Compared to

intelliDRILLse II maximum jump rates are increased by more than 15% for

jump distances of 1 mm and more than 40% for jump distances of 0.2 mm

at a focal length of 100mm. Please refer to SCANLAB sales for prototypes of

excelliDRILL. intelliDRILLse II and excelliDRILL provide identical mechanical

and optical interfaces, ensuring compatibility with existing machine designs.

Typical Applications

intelliDRILLse II and excelliDRILL are optimized for a wide range of laser

microdrilling tasks in electronics manufacturing. These include:

• HDI PCB production – enabling precise via structures in high-density

interconnect boards, such as Any-Layer HDI

• Via hole drilling (VHD) – for multilayer interconnects

• Percussion drilling – for high-speed, high-volume hole creation

• Microvia creation – for fine-featured circuit designs

Enabling high-precision CO2 laser drilling for advanced PCB processing:

SCANLAB’s intelliDRILLse II and the new excelliDRILL are specialized

scan systems designed for demanding microdrilling tasks such as high

density interconnects (HDI).

Modern printed circuit boards require an ever-increasing number of

vertical interconnects, also known as vias. The density of these

interconnects continues to increase, while their size decreases.

Precision is of central importance for the functional implementation of

such designs. At the same time, manufacturing methods must offer very

high throughput.

Technology Overview

Laser drilling is an ideal process for the application, as it allows a very large

number of fine holes to be produced with a very high degree of precision.

For CO2 drilling processes, the laser spot has to be moved to a designated

position and it has to be settled precisely within tolerance, whereafter the

laser is triggered. A key requirement for this is a suitable scan system that

is capable of performing this “jump and shoot” process with maximum

efficiency. intelliDRILLse II and excelliDRILL are developed to meet the

specific requirements of high-precision microdrilling tasks.

Key Features

• Fast step response times permit highest throughput

• New motor design with improved thermal management

• Lightweight beryllium mirrors

• Digital dynAXISse encoder technology

• Drill time optimization(1):

– automatic jump time setting for all jump lengths

– time-efficient parallel handling of positioning and laser delays

• On request also available with SCANahead technology

Typical Applications

• PCB industry

• Via hole drilling

• Percussion drilling

Specifications

Aperture 20 mm

Maximum scan angle(2) ± 0.349 rad

Wavelength(3) 9400 nm

Step response

(positioning and settling to ±5 μm at

100 mm focal length)

0.22 ms at 0.25 mm

0.25 ms at 0.5 mm

0.34 ms at 1 mm

Temperature drift(2) Offset: < 10 μrad/K

Gain: < 5 ppm/K

Long-term drift(2)

(8-hour-Drift after 30 min warm-up,

at constant ambient temperature and load)

Offset: < 50 μrad

Gain: < 50 ppm

Power supply requirements 48 V, 6 A (RMS)

Water cooling requirements 3 l/min at 20 °C and

Δp < 1 bar, p < 4 bar

Key Features

• Outstanding drilling rates are made possible by significantly

reduced step response times

• New motor design with improved thermal management

• Lightweight beryllium mirrors

• Digital dynAXISse

encoder technology

• Automatic jump delay setting for all jump lengths (1)

Typical Applications

• PCB industry

• Via hole drilling

• High density interconnects (HDI)

Specifications

Aperture 20 mm

Maximum scan angle(2) ± 0.349 rad

Wavelength(3) 9400 nm

Step response

(positioning and settling to ±5 μm at

100 mm focal length)

0.13 ms at 0.2 mm

0.22 ms at 0.5 mm

0.29 ms at 1 mm

Temperature drift(2) Offset: < 10 μrad / K

Gain: < 5 ppm / K

Long-term drift(2)

(8-hour-Drift after 30 min warm-up,

at constant ambient temperature and load)

Offset: < 50 μrad

Gain: < 50 ppm

Power supply requirements 48 V, 3 A (RMS)

Water cooling requirements 3 l / min at 20 °C and

Δp < 1 bar, p < 4 bar

(1) RTC6 control board required

(2) all angles are optical angles

(3) others on request

Typical System Components SCANLAB

• SCANmotionControl

software package for extended image field processing.

• RTC6 PCIe

control board with SCANahead and SCANmotionControl option

• excelliSCAN or intelliSCAN IV high-end scan head

ACS

• Motion Controller

controls stage motion and EtherCAT network

• Servo Drives

adapted to system requirements

• SLEC

interface between RTC6 PCIe control board and ACS EtherCAT network

ACS components must be specified in accordance with your system’s

requirements – contact ACS Motion Control.

Components from external suppliers

• XY stage

• Laser

Additional Options

•  Multiple stages, SCANmotionControl instances and scan heads

•  3D-XL SCAN option: additional Z-stage or excelliSHIFT for precise z-axis control

Typical Applications

• Large-field marking, cutting and engraving

• Processing of glass and foils

• Micromachining

• Drilling of large-area PCBs

High-End Laser Processing

The schematic diagram depicts XL SCAN’ssystem configuration.

This scan solution combines SCANLAB’s proven scan head

control with an XY stage positioned via ACS’s innovative motion

control system.

The laser spot’s movement across the workpiece is automatically

split between the scan head and XY stage, thus assuring optimal

utilization of the entire system’s available dynamics. The scan head

is responsible for short rapid motions, while the stage extends the

working surface.

Typical System Components SCANLAB

• SCANmotionControl

software package for extended image field processing.

• RTC6 PCIe

control board with SCANahead and SCANmotionControl option

• excelliSCAN or intelliSCAN IV high-end scan head

Unbeatable precision meets large-field laser processing

XL SCAN is a combined scan solution jointly-developed by  SCANLAB

and ACS Motion Control. This innovative solution enables maximum-

precision processing of workpieces without size limitations.

Key Features

• Scan solution for large-field processing

• High throughput

• Market-leading accuracy

• No stitching errors

• High-dynamics processing without stage vibration

• Unlimited job duration

• Automatic laser control, e.g. Spot Distance Control (SDC)

• Capability of combining multiple software instances, stages

and scan heads

XL SCAN is based on the innovative concept of the SCANmotion

Control software, which combines the synchronous control of

a scan head and an XY-table with intelligent trajectory planning.

XL SCAN thus  delivers the highest precision of all solutions

currently on the market. Maximum flexibility and enormous

throughput increases are  attainable by combining XL SCAN

with several  SCANmotionControl instances, multiple stages

or multi-head systems.

Automatic Fine Adjustment

precSYS‘s factory-precalibrated beamposition measurement unit can be used

for monitoring the system’s beam position. If the beam position exceeds the

application specific tolerance limit, then the software can be used to readjust

the beam back to its original zero position by the system internal five galvo axes.

Advantages:

•  Beam position stabilization close to the working field minimizes deviations

along the beam path from laser to workpiece

•  Lastingly reproducible process results without complicated effect analysis

and manual readjustment

•  Beam position monitoring via maintenance software program

•  Automatic readjustment of beam position and angle via the DrillControl

software  (regulation via system-internal galvo axes)

•  Supports precSYS alignment during commissioning and servicing