Month: September 2026

Beam Alignment Module

The Beam Alignment Module (BAM) from Pulsar

Photonics is a modular solution for active beam

position stabilization. Effects on the beam

position due to e.g. pointing errors and thermal

effects of laser sources or fluctuations of the

ambient temperature can be measured and

actively compensated. Thus, constant process

results are possible even under fluctuating

conditions.

Due to its modular design, the BAM can be flexi

bly adapted to different machine types, designs

and applications. Furthermore, the connection of

a gas or overpressure purge and the use of the

Pulsar Tube System can guarantee a high degree

of dust-free operation, making the module suita

ble for laser sources with high pulse energy and

high beam quality.

Technical drawing and technical data

• Max. Dimensions: (L x W x H):   650mm x 680mm x 340mm

• Addressable field size with SLM:  approx. 4mm x 4mm @f=100mm

Wavelengths

• IR  (1030nm-1070nm)

• VIS  (515nm-532nm) on request, only for low power

Laser input

• Max. beam diameter: 6 mm

• TEM00. M² ≤ 1.3

Suitable laser beam sources

• nanosecond / picosecond / femtosecond

(>800fs) (low spectral bandwidth

recommended)

• max. Power: 100 W (IR), <20W (VIS)

• max. Pulse energy: 500 µJ @ 1ps (IR)

Suppression of higher orders

Galvanometer scanner

• Type: SCANLAB intelliSCAN III 14 or excelliSCAN 14

• Focal lengths: 50mm-500mm (typ. 100mm)

Control software – Photonic Tools

• Software for adjustment, calibration and control of the system

• Camera-supported adjustment and calibration

• Software kit for creating complex profiles

• Generation of 2D and 3D distributions

• Digital tool-changing system

Optional components

• Switching between single beam and multiple beam processing

• Motorized alignment of laser beam into the module

• Coaxial camera

• Ext. Camera system for intensity measurement

Dynamic beam shaping system

Beam shape on demand

The FlexibleBeamShaper (FBS) is a machine integrable

beam shaping system for laser micromachining, that can

generate any user defined beam distributions.

To achieve this, the FBS is equipped with an electronically

controllable optical phase modulator. This allows the FBS

to be used as a photonic tool magazine with predefined

beam shapes on demand. In addition, the FBS is equipped

with a SCANLAB galvanometer scanner, so the generated

intensity distribution can be scanned over the workpiece.

These tools combined in a single system open up new

ways in laser  micromaching:

faster, more flexible and more efficient.

Technical drawing and technical data

• Max. Dimensions: (L x W x H):   650mm x 680mm x 340mm

• Addressable field size with SLM:  approx. 4mm x 4mm @f=100mm

Wavelengths

• IR  (1030nm-1070nm)

• VIS  (515nm-532nm) on request, only for low power

Suitable pulse durations

• Nanosecond / Picosecond / Femtosecond

• Max. Power: 150 W

• Max. Pulse energy: 1 mJ @ 1ps

Functions

• Masking of higher orders

• Integrated beam position stabilisation to ensure alignment

• Rotation of beam distribution

• Fine adjustment of spot pitch

• Switching between single-beam and multi-beam processing

Spot position error

• <3 µm @ f=100mm

Spot distributions

• e.g. 2×2. 4×4. …, 8×8.

user defined distributions

Galvanometer-Scanner

• Type: SCANLAB intelliSCAN III 14 or excelliSCAN 14

Control software – Photonic Tools

• Software for adjustment, calibration and control of the system

• Camera-assisted adjustment and calibration

Optional components

• Ext. camera system for intensity measurement

Massive process acceleration through parallel machining

The unique combination of a precise galvano metric scanning

system and beam splitting in one system allows to multiply laser

cutting, drilling or ablation processes without loosing the freedom

of geometry of the scanner. Using diffractive opticalelements (DOEs)

the incoming laser beam is split up into multiple beams, generating

multiple laser spots in the work plane of the scanning system.

This way multpile structures can be processed in parallel or,

for example, complex cut patterns can be realized while multiplying

the production output. The MultiBeamScanner is the solution to

significatly reduce production costs in laser micromachining of periodic

structures by up to two orders of magnitude.

Wavelengths

• IR  (1030nm-1070nm)

• VIS  (515nm-532nm)

• UV  (343nm-355nm)

Massive process acceleration through parallel machining

The unique combination of a precise galvano metric scanning

system and beam splitting in one system allows to multiply laser

cutting, drilling or ablation processes without loosing the freedom

of geometry of the scanner. Using diffractive opticalelements (DOEs)

the incoming laser beam is split up into multiple beams, generating

multiple laser spots in the work plane of the scanning system.

This way multpile structures can be processed in parallel or,

for example, complex cut patterns can be realized while multiplying

the production output. The MultiBeamScanner is the solution to

significatly reduce production costs in laser micromachining of periodic

structures by up to two orders of magnitude.

Wavelengths

• IR  (1030nm-1070nm)

• VIS  (515nm-532nm)

• UV  (343nm-355nm)

Scan lens for ultra-high resolution applications ‚the 1μm laser knife‘

Extend your laser machine with a High-NA scanning solution

With the Microscan Extension MSE, Pulsar Photonics offers a simple but powerful extension for

any galvo scanning system. By simply exchanging a conventional scan lens with the MSE-G2. the

user can convert his machine to a micro spot scanning system. The combination of galvanometer

scanner and MSE-G2 allows high-precision processing with a focus diameter of less than 4μm.

This enables the production of the smallest components with unmatched accuracy and level of

detail. We offer the system for IR, VIS and UV wavelengths.

Technical data

• IR/VIS Version: MSE-G2 IR/VIS

• UV Version: MSE-G2 UV

• Max. Dimensions: (L x W x H): 245mm x 145mm x 120mm

• Working distance: > 20 mm (IR/VIS), > 10 mm (UV)

• Scan field size: typ. 500µm x 500µm

• Integrated coaxial camera

• Fastening thread: M85x1 (standard galvo scanner)

• Integrated collision protection

Wavelengths

• IR (1030nm-1070nm) + VIS (515nm-532nm)

• UV (343nm-355nm)

Spot sizes (for laser beam source with M²< 1.3)

• < 4µm    (IR/VIS version)

• < 2µm    (IR/VIS version)

• ≤ 1.5µm (UV version)

• LIDT coating @ 355nm; 10ps: < 0.5mJ/cm²

• LIDT coating @ 532nm; 10ps: < 3mJ/cm²

• LIDT coating @ 1064nm; 10ps: < 6mJ/cm²

excelliDRILL

excelliDRILL is SCANLAB’s latest product development for drilling printed

circuit boards. The new motor design, SCANahead based control algorithms,

together with proven SE encoder technology, and lightweight beryllium mirrors

enable outstanding drilling rates with maximum precision. Compared to

intelliDRILLse II maximum jump rates are increased by more than 15% for

jump distances of 1 mm and more than 40% for jump distances of 0.2 mm

at a focal length of 100mm. Please refer to SCANLAB sales for prototypes of

excelliDRILL. intelliDRILLse II and excelliDRILL provide identical mechanical

and optical interfaces, ensuring compatibility with existing machine designs.

Typical Applications

intelliDRILLse II and excelliDRILL are optimized for a wide range of laser

microdrilling tasks in electronics manufacturing. These include:

• HDI PCB production – enabling precise via structures in high-density

interconnect boards, such as Any-Layer HDI

• Via hole drilling (VHD) – for multilayer interconnects

• Percussion drilling – for high-speed, high-volume hole creation

• Microvia creation – for fine-featured circuit designs

Enabling high-precision CO2 laser drilling for advanced PCB processing:

SCANLAB’s intelliDRILLse II and the new excelliDRILL are specialized

scan systems designed for demanding microdrilling tasks such as high

density interconnects (HDI).

Modern printed circuit boards require an ever-increasing number of

vertical interconnects, also known as vias. The density of these

interconnects continues to increase, while their size decreases.

Precision is of central importance for the functional implementation of

such designs. At the same time, manufacturing methods must offer very

high throughput.

Technology Overview

Laser drilling is an ideal process for the application, as it allows a very large

number of fine holes to be produced with a very high degree of precision.

For CO2 drilling processes, the laser spot has to be moved to a designated

position and it has to be settled precisely within tolerance, whereafter the

laser is triggered. A key requirement for this is a suitable scan system that

is capable of performing this “jump and shoot” process with maximum

efficiency. intelliDRILLse II and excelliDRILL are developed to meet the

specific requirements of high-precision microdrilling tasks.

Key Features

• Fast step response times permit highest throughput

• New motor design with improved thermal management

• Lightweight beryllium mirrors

• Digital dynAXISse encoder technology

• Drill time optimization(1):

– automatic jump time setting for all jump lengths

– time-efficient parallel handling of positioning and laser delays

• On request also available with SCANahead technology

Typical Applications

• PCB industry

• Via hole drilling

• Percussion drilling

Specifications

Aperture 20 mm

Maximum scan angle(2) ± 0.349 rad

Wavelength(3) 9400 nm

Step response

(positioning and settling to ±5 μm at

100 mm focal length)

0.22 ms at 0.25 mm

0.25 ms at 0.5 mm

0.34 ms at 1 mm

Temperature drift(2) Offset: < 10 μrad/K

Gain: < 5 ppm/K

Long-term drift(2)

(8-hour-Drift after 30 min warm-up,

at constant ambient temperature and load)

Offset: < 50 μrad

Gain: < 50 ppm

Power supply requirements 48 V, 6 A (RMS)

Water cooling requirements 3 l/min at 20 °C and

Δp < 1 bar, p < 4 bar