Emerson RXi2-BP Enhanced Productivity & Lower Total Cost of Ownership (TCO)
Greater Uptime
All aspects of the PACSystems RXi2-BP IPC have been
engineered for reliability in harsh environments. With high
quality industrial components, a rugged design, and fanless
operation, it is perfect for both commercial and industrial
applications. The PACSystems RXi2-BP IPC is a highly reliable
IPC with a long life cycle.
The foundation of the PACSystems RXi2-BP IPC architecture
is Emerson’s rugged COM Express modular CPU platform.
Emerson also incorporates patented thermal monitoring
technology with sophisticated passive cooling techniques
to provide the highest-performance, fanless industrial
computing platform that can operate in extended
temperature ranges.
Enhanced Productivity &
Lower Total Cost of Ownership (TCO)
The foundation of the PACSystems RXi2-BP IPC combines
high performance with reliability, enhancing productivity
and reducing cost of ownership. The PACSystems RXi2-BP
IPC delivers low TCO through features such as compact size,
reduced maintenance, low power consumption, and ease
of future performance upgrades enabled by our innovative
rugged COM Express CPU architecture.