Category: GE

Board installation parameters provided by the manufacturer should be met to minimize 

the risk of equipment failure or error. Board functionality is dependent on proper wiring of the system.

An illustrated guide for wiring and installing the DS200FCGDH1B is provided in the equipment manual and data sheet.

The entire Mark V series was originally powered by General Electric.

The above additional information for this DS200FCGDH1B printed circuit board product

is largely reminiscent of the general Mark V Series instruction documentation

and visual inspection of the DS200FCGDH1B unit itself.

This strategy was deemed necessary due to the legacy series status of

this DS200FCGDH1B product and the concomitant lack of on-line instructional

manual material that could be utilized for research purposes on this page.

With this in mind, the DS200FCGDH1B functional product number itself

can be considered an important source of information on DS200FCGDH1B Board hardware components and component specifications.

as it encodes a range of details in a series of consecutive function naming blocks.

For example, the DS200FCGDH1B Functional Product Number begins with

a dual-function DS200 series label representing the normal Mark V series components of

that DS200FCGDH1B product and its original domestic manufacturing location.

Some other relevant hardware details revealed through the use of

the DS200FCGDH1B Functional Product Number include this Mark V Series PCB:

.FCGD Functional Product Abbreviation

.First Mark V Series Product Grouping

.Conformal pattern of PCB protective coatings

.Class B Functional Product Revision

basic layer of daily wear protection provided by its conformal PCB surface coating.

Hardware Tips and Specifications

The DS200FCGDH1B is a door assignment and status card (FCGD). 

Developed by General Electric for its Mark V board family,

the card can be installed in many GE-branded drives.

Once installed, the card acts as the interface system for a six-pulse phase control non-inverting bridge.

the DSPC (Digital Signal Processing Card) relays information to the board for decryption.

This generates signals about diagnostic information and system feedback.

This generates signals for diagnostic information and system feedback,

which are then sent out using the drive’s integrated VME backplane.

This DS200FCGDH1B product collects a large amount of data from the drive’s integrated DSPC.

The signals received by the board are converted to unit gating signals.

All system bridge pins receive this cell gating signal and return multiplexed cell

status information to the card. the FCGD board also receives and scales feedback signals.

The three FGPA boards send feedback signals through fiber optic connections on the board.

The included feedback includes frequency, voltage, and board status information.

The integrated IMOK LED status indicator provides the user with basic system status.

This DS200FCGDH1B printed circuit board product manufactured by General Electric

was originally designed and manufactured for placement in its Mark V family of turbine control systems.

This DS200FCGDH1B printed circuit board, or PCB for short, is considered a member of the Mark V family.

It has specific applications in the management and control systems of popular and compatible wind,

gas and steam turbine automatic drive assemblies, as evidenced by the full extended family name provided above.

This Mark V family of DS200FCGDH1B Printed Circuit Boards, or PCBs for short,

while related to newly developed alternative energy technologies

must still be considered an obsolete GE legacy product line, as it was massively discontinued

due to obsolescence many years after the release of the original Mark V line of products.

The Mark V series of this DS200FCGDH1B PCB, while generally obsolete due to its legacy series status,

still offers many highly sought after products.

This is because it exists as one of the definitive General Electric Mark product lines,

utilizing the company’s patented Speedtronic control system technology.

In addition, the DS200FCGDH1B PCB does not exist as the original development

of its intended Mark V series functionality; this would be the case with the lack of the DS200FCGDH1B PCB.

This would be the DS200FCGDH1 female PCB that lacks the single Level B functional product revision of the DS200FCGDH1B product.

The single plug-in connector that can be used to assemble this DS200ITXDG1ABA Dynamic

Braking Buffer Board is also fully discussed in the associated General Electric instruction manual material.

This connector is accompanied by a DBPL factory printed naming label and

connects this DS200ITXDG1ABA product to the accessible IMCP cousin PCB product in the larger Mark V series automatic drive assembly.

For convenience, the plug-in connector location for this DS200ITXDG1ABA PCB is described separately in the available guidance material.

Before making any single final purchase decision on this DS200ITXDG1ABA Dynamic Brake Buffer Board,

it is important to realize that it was originally designed to be used as a dynamic brake buffer board.

It is important to realize that the performance specifications and dimensions it

was originally introduced with have undoubtedly changed as a result of its receiving a full triple revision history.

The ITXD board allows for adjustment of the various outputs in the Mark VI series.

There are three different connector types on the board, allowing the board to be connected in a variety of different ways.

This DS200ITXDG1ABA printed circuit board product or PCB for

short has the normal style of Mark V series assembly, although it has been edited

by accepting the full range of three Mark V series feature and illustration configuration product revisions.

Hardware Tips and Specifications

The required operation of the IXTD board is provided through the circuitry

of the connected power supply/interface board (IMCP).

When the IMCP and the IXTD board are connected, they are connected via a four-pin connector.

When the board is installed, it will be externally mounted and must

be sized to meet the worst-case switching requirements of dynamically braked IGBTs.

The purpose of the snubber board is to be used to limit voltage transients

​at both ends of the IGBT and at all known operating conditions of the driver.

Another function of the DS200ITXDG1ABA board is to regulate the output

of the IGBT gate driver board to match the electrical characteristics of the AT frame driver.

AT frame drivers are available in variable and constant torque applications.

The drive output current rating for variable torque applications is 500 ARMS.

The DS200ITXDG1ABA board has three connector types: bus I/O connectors,

input connectors for DBPL, and board pin connectors.

All of these connector types have different pin numbers, nomenclature,

and descriptions, which are explained in depth and in detail in the 

DS200ITXDG1ABA instruction manual included above for your convenience.

Bus I/O connectors and pin I/O connectors are also oriented. 

Two examples of pins associated with the stab I/O connectors are the

E-6 and E-9 connectors, both of which are output connectors.

The E-6 connector is the DB IGBT gate signal and the E-9 connector is the connection for the external buffer resistor.

About the DS200ITXDG1ABA

The DS200ITXDG1ABA board is labeled as a Dynamic Brake Buffer Board and

is part of the Mark V Series manufactured by General Electric.

The Mark V Series, of which this DS200ITXDG1ABA product is a part,

was one of the last of General Electric’s Mark product line to incorporate

Speedtronic control system technology into its various products.

And since it was eventually discontinued many years after its initial release, it exists as a legacy product line.

This DS200ITXDG1ABA Printed Circuit Board, or PCB for short, is not an original development for

its specific Mark V Turbine Control System family of functional roles;

it is actually the DS200ITXDG1 Parent Dynamic Brake Buffer Board.

The DS200ITXDG1ABA PCB is conspicuously missing all three versions

of the three important product versions of the DS200ITXDG1ABA PCB.

The assembly of this DS200ITXDG1ABA PCB has been specifically

altered to utilize a Level A Major Function Revision, a Level B Minor Function Revision, and a Level A Drawing Configuration Revision.

Product Overview

-The Reflective Memory concept provides a very fast and efficient way to share data between distributed computer systems.

VMIC’s VMIVME-5576 Reflective Memory interface allows data to be shared between up 

to 256 independent systems (nodes) at rates of up to 6.2 Mbyte/s. Each Reflective Memory board can be configured with up to 256 nodes.

Each Reflective Memory board can be configured with 256 Kbytes to 1 Mbyte of on-board SRAM.

local SRAM allows fast reads of stored data.

Write data is stored in the local SRAM and broadcast to other Reflective Memory nodes via a high-speed fiber optic data path.

Data transfers between nodes are software transparent, so there is no I/O overhead.

Transmit and receive FIFOs buffer data during peak data rates to optimize

CPU and bus performance and maintain high data throughput.

Reflective memory also allows interrupts to one or more nodes by writing to byte registers.

These interrupt (tertiary, user-definable) signals can be used to synchronize system processes or to follow any previous data.

Interrupts always follow the data to ensure that the data is received before the interrupt is acknowledged.

The VMIVME-5576 does not need to be initialized unless interrupts are used.

If interrupts are used, vectors and interrupt levels must be written to on-board registers and interrupts must be set.

Each node on the system has a unique identification number between 0 and 255.

The node number is determined by placing jumpers on the board during hardware system integration.

The node number can be read by software by accessing the on-board registers.

In some applications, the node number helps determine the function of the node.

Features

– High-speed, easy-to-use fiber optic network (170 Mbaud serial rate)

– Data written to the memory of one node is also written to the memory of all nodes on the network

– Up to 2.000 meters between nodes, up to 256 nodes can be connected

– Data transfer rate of 6.2 Mbyte/s without redundancy

– Data transfer rate of 6.2 Mbyte/s without redundancy Data transfer rate of 3.2 Mbyte/s with redundancy

– Any node on the network can generate an outage in any other node on the network or in all network nodes with a single command

– Error detection – redundant transmission mode suppresses errors

– No processor overhead

– Processor is not involved in network operation

– Up to 1 Mbyte of reflected memory

– A24:A32:D32:D16:D8 Memory Access

– Single 6U VMEbus board

The module has sixteen (16) normally open (N.O.) contacts divided into four (4) banks of four (4) outputs each.

Each contact output can operate at 5-30 VDC with a nominal voltage of 24 VDC; 5 – 250VAC at 47 to 63 Hz with a nominal input voltage of 120/240VAC.

Each channel is designed for a 2 Amp lead load, a maximum load per output and a maximum load of 4 Amps per common.

The module has a current draw of 7 mA with all outputs turned on by the 5 V bus on the backplane and 24 mA with all outputs turned on by the relay 135V bus on the backplane.

The IC694MDL940 is a sixteen (3) point relay output module for the Emerson Automation PACSystem RX16i series, formerly manufactured by GE Intelligent Platforms (GE IP).

The module has a single slot width, occupies a single slot on the backplane, and comes with four (4) output groups of four (4) relay outputs each.

The IC694MDL940 relay contacts are normally open (N.O.) contacts or type A contacts. Each output contact is rated for a maximum load of 2 amps pilot load.

About the IC694MDL930

This IC694MDL930 is part of the PACSystem RX3i midrange programmable automation controller (PAC) platform.

It is designed for use as a relay output module with eight (8) independently isolated normally open (N.O.) or A-type contact outputs.

Each output contact essentially has a separate common and dry contact, allowing different voltage types and levels to be connected exclusively to the module.

i.e. 5-30 VDC (nominal 24 VDC) and 5-250VAC (nominal 120/240VAC).

The current capacity of each output channel is 4 amps per output when used with resistive loads and 2 amps per output when used with pilot load devices.

Current capacity is 2 amps per output channel. For UL installations, the maximum load current that the module can withstand is 30 amps and varies according to ambient temperature.

Conversely, the minimum load that the module can withstand is 10 mA, and the module’s output channels have a typical response time of 15 ms between on and off switching, while the module’s maximum backplane current is 2 amps.

The module’s maximum backplane current draw is 6 mA, and all outputs are energized by a 5 VDC bus on the backplane.

All outputs are energized by a relay 70VDC bus on the backplane and the maximum backplane current consumption is 24mA.

The module also supports mounting to 90-30 series backplanes. It can be used as a local output module, mounted on a central processing unit (CPU) chassis, or with an appropriate communications adapter.